Benarji Nalamala

About Benarji Nalamala

At Intel : GPU’s / Liquid Cooling: Delivered 1500 W GPU Single phase cooling solution with the constraints of \'SoC WL condition & Cold Plate thickness\'. Delivered ultra-thin form factor thermal solution for custom VRMs. Path Finding Thermal activities performed for future SoC Designs. Lead the Thermal / Mechanical Test Board design and development activity by collaborating with the cross functional teams. Delivered Air Cooling Thermal Design Solutions for one of the Test boards. Reviewing the ODM deliverables & guiding the thermal designs. Involved in setting up the Thermal Testing lab for the liquid cooling. Knowledge and experience in SoC [package]/ board level electro thermal activities. At Collins Aerospace: A competent Leader as well as Engineer to provide the cooling solutions for Aircraft LRU\'s in Mechanical [Simulation, Testing and Modeling] domain. At HCL & Wipro: Thermal Management of Electronic Products’ in ‘Telecom, Computing and Storage’ domains.

Experience

1. Thermal Mechanical Hardware Product Development Ai, Data Center (Gpu Cpu) Aerospace

   Intel

   Dec 2022 — Present · Bengaluru, IN

Education

• Jawaharlal Nehru Technological University

  B. Tech, Mechanical Engineering

  1999 — 2003

• Indian Institute of Technology, Madras

  M.S (By Research), Specalized in Heat Transfer in Mechanical Engineering

  2004 — 2006

Skills

• Matlab
• Fluid Dynamics
• Engineering
• R&D
• Computational Fluid Dynamics (Cfd)
• Cfd
• Ansys
• Thermal
• Cae
• Thermal Testing
• Icepak
• Thermal Analysis
• Ansys Fluent
• Flotherm
• Product Design
• Team Center Engineering
• Finite Element Analysis
• Heat Transfer
• Pro Engineer