Brandon Gary

About Brandon Gary

Driven team oriented mechanical engineer with experience in both mobile and embedded…

Experience

1. Senior Ii Thermal Mechanical Architect (Azure)

   Microsoft

   Jul 2018 — Present

   Thermal/Mechanical Architect for Microsoft Azure’s component, module, server, rack and data center infrastructure products (chip-to-chiller); in-house development (little to no dependency on ODM leveraged designs). Most responsibilities below are from cross-functional team interaction and co-developed CAD and/or thermal modeling- Developed and modified CAD models (in either Pro/e or Solidworks) in a team based environment to investigate trade-offs between licensing or developing new technologies vs. leveraging existing technologies and optimizing existing platform layouts. Purpose of investigations were to drive an overall solution that was optimized to benefit both Microsoft’s TCO and customer performance requirements- Lead the standardized process for TCO calculations pertaining to thermal related energy savings via component or platform layout optimizations. This includes, but is not limited to optimizing liquid hose routing to reduce pressure and pump energy consumption; heat sink optimization; platform architecture improvements from component placement and/or new chassis development. Thermal component developments considered both package and board structural challengers, chassis flex from sag and bow, and other mechanical rigidity considerations- Resident simulation analysis subject matter expert and organization lead simulation accuracy from 70% theoretical to empirical to 93%+ accuracy between simulation and deployed equipment. This resulted in 33% reduction in development time, pre-hardware TCO/Rack-elevation/power limitation predictions, multi-generational sheet metal support (drop-in socket without change to any of the hardware), improvements to sustainability goals (chassis re-use), and reduced cost and dependency on ODM’s to develop chassis- Fleet has seen a reduction in AIR from servers I\'ve co-developed- Multiple patents filed/approved (Google searchable)-Co-authored thermal methodology for OCP E1.S specification developement.

Skills

• Microelectronics
• Labview
• Computer-Aided Design (Cad)
• Thermal Analysis
• Thermal Engineering
• Microsoft Excel
• Pro Engineer
• Fluid Mechanics
• Simulations
• Testing
• Embedded Systems
• Data Analysis
• Thermal Modeling
• Microsoft Office
• Siemens Nx
• Matlab
• Engineering
• Sensors
• Nx Unigraphics
• Fluent
• Cfd
• Ptc Creo
• C++
• Cad/Cam
• Cad
• Ansys
• Mechanical Engineering
• Icepak
• Pro/Engineer
• Heat Transfer
• Solidworks
• Autocad
• Thermal System Design
• C