Balachandran Shivaswamy
Senior Engineer – Microelectronics Packaging Design
- Role
- Sr Packaging Design Engineer at AMD
- Location
- Coimbatore, TN, IN
- LinkedIn followers
- 500 followers
About Balachandran Shivaswamy
At AMD, my role as a Senior Packaging Design Engineer revolves around optimizing advanced FPGA packaging, a task that leverages my deep-seated expertise in PCB design and mixed signal systems. Our collaborative endeavors have significantly contributed to AMD\'s recognition as a frontier in semiconductor technologies, particularly within the realms of 7nm and 16nm products.Previously, the foundation of my skill set was solidified through a focus on the development, debugging, and validation of test hardware for FPGA products. This experience has been instrumental in my current mission to drive innovation and maintain our industry\'s momentum towards cutting-edge integrated circuit packaging solutions.
Experience
Sr Packaging Design Engineer
Aug 2020 — Present · Hyderabad, IN
Hyderabad, Telangana, India
Education
Nehru Institute of Engineering and Technology
Bachelor of Engineering - BE
2008 — 2011
Skills
- Orcad
- Pads
- Pcb Design
- Analog
- Pcb Layout Design
- Altium Designer
- Embedded Systems
- Eda
- Cadence
- Allegro
- Microcontrollers
- Schematic Capture
- Rf
- Signal Integrity
- Mixed Signal
- Circuit Design
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