Ayan Biswas

About Ayan Biswas

With over a decade in semiconductor engineering, I am currently a Senior Staff Reliability Engineer at Wolfspeed, specializing in SiC power semiconductor reliability for automotive, industrial, and renewable energy applications. I drive innovation and robust performance through expertise in process integration, advanced data analysis, and Design for Reliability (DfR), developing lifetime/aging models while collaborating with cross-functional teams and stakeholders to deliver solutions aligned with Wolfspeed’s mission of accelerating adoption of advanced power technologies. I play critical role in device reliability programs, applying deep knowledge of test methodologies, lifetime predictions, and mission profiles. I author peer-reviewed publications, contribute to industry standards via JEDEC and IEC committees. Previously at Intel Corporation, I specialized in fuse (PROM) technology development and bring-up for 7nm-techology nodes while collaborating with global teams across the US, Costa Rica, Israel, and China. I also supported MRAM development, created data analysis tools, optimized sort/class test flows, and worked with design, yield, reliability, and TCAD groups to resolve silicon issues and speed new product ramps. These efforts earned multiple Divisional and Department Recognition Awards for yield improvement, debug efficiency, and test innovations.My foundation comes from a PhD in hybrid straintronics and spintronics at Virginia Commonwealth University, enhanced by postdoctoral and fabrication work at Carnegie Mellon University. I pioneered modeling, design, and experimental validation of energy-efficient nanomagnetic devices switched by voltage-generated strain, targeting ultra-low-power Boolean/non-Boolean computing and neuromorphic hardware. This produced over eight first-author publications in leading journals—including Nano Letters, Applied Physics Letters (three papers), Scientific Reports, and Nanotechnology—plus co-authored papers, a book chapter, and one issued U.S. patent on magneto-elastic non-volatile multiferroic logic/memory with ultralow energy dissipation. I gained deep expertise in MTJ characterization (SEM, TMR, Flexus, Nanospec, Cascade/DC probes), simulation and automation (COMSOL, OOMMF, MuMax, Cadence SKILL), and nanofabrication (ASML stepper lithography, PVD, ion milling, RIE, e-beam lithography).

Experience

1. Senior Staff Reliability Engineer

   Wolfspeed

   Mar 2023 — Present

   Lead comprehensive device reliability programs for SiC power semiconductors, driving deep expertise in process integration, test methodologies, advanced data analysis, reliability modeling, lifetime predictions, mission profiles, and Design for Reliability (DfR) to ensure robust performance in automotive, industrial, and renewable energy applications.• Frequently publish peer-reviewed technical papers in prestigious international conferences and journals, advancing industry knowledge on wide-bandgap device reliability and failure physics.• Actively contribute as a key participant in JEDEC (Wide Bandgap Power Semiconductors) and IEC committees, co-authoring and influencing industry standards.• Develop and implement reliability test plans, statistical analysis frameworks, and lifetime estimation models that support product qualification, continuous improvement, and long-term field reliability of Wolfspeed’s industry-leading SiC portfolio.• Deep expertise in intrinsic device failure mechanisms (HCI, TDDB, ARB, PBTI, NBTI, EM, SM, SEB, ESD etc.) and product-level failure modes, along with their respective reliability test methods (HTOL, HTRB, HTGB, TC, PC etc.)• Strong command of reliability testing methodologies, accelerated lifetime models, and device aging physics; experienced in procuring and maintaining test equipment, as well as modeling device performance and degradation• Collaborate cross-functionally with design, process, and quality teams to integrate reliability considerations early in the product lifecycle, achieving high-confidence qualification results and enabling accelerated adoption of next-generation SiC technologies.

Education

• Virginia Commonwealth University

  Doctor of Philosophy (Ph.D.), Electrical and Computer Engineering

  2012 — 2016