Ayad Ghannam

CEO, Founder @3dis Technologies

Toulouse, FR

3DiS Technologies offers an innovative packaging and 3D interconnect technology for the integration of miniaturized electronic systems and high performance 3D passive devices. Based on a reduced number of technological steps and perfectly adaptable to the constraints of the client\'s application, the proposed process is ideal for System-in-Package, Wafer-Level-Packaging and network sensors assembly. Our cost effective solution reduces time-to-market and leads to miniaturized and more efficient electronic systems.