Atte Focho

Lead Application Engineer @Ansys

Munich, DE
MOBILE NUMBERS
+91 *********19

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WORK HISTORY

Apr 2019 — Present

Lead Application Engineer @Ansys

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Munich, DE

Product owner - Electronics Thermal Management Simulation Automation: Product owner and simulation subject matter expert within scrum team focused on the development of software for Computational Fluid Dynamics simulation workflow automationPre- and Post-Sales Engineer – Electronics Thermal Management Applications: enabling organizations to reduce product design cycles through Computer-Aided Engineering Thermal simulation with Ansys Icepak for Electronics Thermal Management, Multiphysics simulation for Electronics Thermal Reliability and Multiphysics simulation for Electronics Structural Reliability with Ansys Mechanical

EDUCATION

N/A

Carl von Ossietzky Universität Oldenburg

Bachelor of Engineering (B.Eng.)

N/A

University of Wisconsin-La Crosse

Non-Degree

N/A

Technische Universität Hamburg-Harburg

Master of Science (M.Sc.)

SKILLS

Signal IntegrityEdaHardware ArchitectureRfSpiceFpgaAsicMatlabAntennasPcb DesignSemiconductorsSimulationsSignal ProcessingSocCaeIcElectronicsElectromagneticsAnalogMixed SignalCircuit Design

ABOUT ATTE FOCHO

Enhancing customer engineering simulation experience with Ansys High Frequency simulation software (Ansys HFSS, Ansys SIwave, Ansys Circuit, Ansys Q3D), as well as Ansys Thermal (Ansys Icepak) and Structural (Ansys Mechanical) software, for full Multiphysics simulations for Electronics Reliability

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Atte Focho — Lead Application Engineer at Ansys in Munich, DE | Unifers