Asjad Malik

Microelectronics Packaging Engineer @Allegro MicroSystems

Develop company’s leading product line alongside a team used in automotive and commercial; project scope includes proof of concept, product qualification and vendor manufacturing capability • Deploy a novel approach of thermal characterization of microelectronic packages using Siemens T3ster equipment in compliance with JEDEC guidelines • Assisted business units with managing customer specific requirements by collaborating across multiple teams of PCB designers, system engineers to innovate further advances in device thermal performance in multiple products • Performed detailed ANSYS simulations on various semiconductor packages including TSSOPs with exposed pad, QFNs, flip chip packages with simulation results in the range of ±5% compared to that of measured lab results