Asim Khaniya

Semiconductor Process Engineer | Photolithography & Wafer Processing | EUV/DUV, DOE/SPC, Yield & Defect Reduction | Thin Films & Materials Integration

Role
Module Development Engineer at Intel
Location
Hillsboro, OR, US
LinkedIn followers
500 followers

About Asim Khaniya

Experienced Process Engineer with a Ph.D. in Physics and 3.5+ years of hands-on…

Experience

  1. Module Development Engineer

    Intel

    Feb 2022 — Present · Hillsboro, OR, US

    Developed, optimized, and qualified advanced lithography processes for Intel’s leading technology nodes, enabling successful high-resolution patterning for advanced device architectures (FinFET and GAA). Supported and enabled HVM ramp and technology transfer through seamless execution of new product introductions (NPI) on FEOL layers. Applied SPC, JMP, and DOE methodologies to analyze lithography datasets, driving a reduction in process variability across pilot and production wafers to met module target specs. Led material screening initiatives and DOE-driven development on cost-effective spin-on underlayers for metal oxide resists. Collaborated closely with cross functional teams (Integration, OPC/RET, and Etch teams) to drive mask design optimizations and pattern fidelity improvements, ensuring the alignment to module target specs (MTS) for yield and performance metrics.

Education

  • University of Central Florida

    Doctor of Philosophy - PhD

    2020

  • University of Central Florida

    Master of Science - MS

    2016

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Asim Khaniya — Module Development Engineer at Intel in Hillsboro, OR, US | Unifers