Ashish Mishra
Helping customers through quality product software release to timely launch and commercialize mobile phone devices across global market.
- Role
- Principal Engineer at 高通
- Location
- Hyderabad, IN
- LinkedIn followers
- 500 followers
About Ashish Mishra
20 Years of Technology, Engineering, Products and Software development experience-Mobile chipset product software release leader and delivery manager for QUALCOMM-Experience in Android based Mobile Handset ecosystem with multiple new product commercialization-Well versed in full cycle of 2G to 5G mobile handset software products. Worked with worldwide cross functional HW, SW and technology teams, product, program managers and customer engineering. Managed offshore development center for Qualcomm SW products- SW leadership and execution experience from Pre silicon validation to Device Board Bring Up to Commercial and Market launch -Understand large scale and complex product technology, system architect, software lifecycle, product engineering and lifecycle-Demonstrated ownership and product technology transfer lead for offshore development center for products of Aeroflex Inc. telecommunication conformance test and Cisco router- Wireless Protocol stack 2G/3G/WLAN/WiMAX/5G - Programing experience C, Assembly, Embedded & DSP, Porting, Integration, Code Optimization
Experience
Principal Engineer
Nov 2012 — Present · Hyderabad, IN
Leading Qualcomm snapdragon multiple chipset product commercial SW releases.Experience in Android based Mobile Handset ecosystem with multiple new product commercialization.Well versed in full cycle of 2G to 5G mobile handset software products. Worked with worldwidecross functional HW, SW and technology teams, product, program managers and customerengineering. Understand large scale and complex product technology, system architect, software lifecycle, product engineering and lifecycle.1) Worked from product concept, requirement to delivery, worked with world’s top leading mobilehandset customer as Google, Samsung, Oppo, Vivo, Motorola and Huawei.2)Presentation to leadership across engineering and executive for project status3)Managed and contributed, Supervised in fast paced complex technology new product cycle of in 90days from silicon on dock to commercial release to customer for a new chipset for 4G4)SW release Lead for Qualcomm first integrated 5G SOC namely Snapdragon 765, workedfrom pre silicon to commercial launches and successfully done market upgrades for productportfolio includes new revised pro SOC SKUs, new Modem RF attach and Android upgrades.5)Coordinated with various stakeholders, leads for decision making6)Lead and driven Software stability quality scrums meetings with test and technology leads7)Worked with Qualcomm across domains across geo locations teams: SOC deign, productmanager, Program Managers, Customer Engineering, Sales and SW technology & test leads8)Supported Product managers, Customer Technical Account Managers for pre-sales andcustomer engagement across China, LATAM, EU, Korea and Japan for feature release, SWproduct roadmap alignment and customer specific tailored SW product line and releasecadence9)Lead for Qualcomm propriety Brew OS based legacy 10+ MSM/MDM(data modem) chipsetfamily SW releases and also Managed 2 ODC for Brew sustenance and RTOS porting work.
Education
Jai Narain Vyas University
B.E.
1994 — 1998
UCLA Anderson School of Management
PGPX @ UCLA Anderson School of Management
2019 — 2020
Indian Institute of Technology Kharagpur
M.Tech
2001 — 2003
Find verified contacts for anyone on LinkedIn
Unifers gives sales teams verified emails and direct dials, enriched profiles, and outreach that lands in the inbox.
Free plan included · No credit card required
This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.