Arunpandi R
Mechanical Engineer-Electronics packaging-Thermal Engineer
- Role
- Thermal Mechanical Engineer at Intel
- Location
- Bengaluru, KA, IN
- LinkedIn followers
- 500 followers
About Arunpandi R
As a Thermal Mechanical Engineer with over 13 years of experience, I specialize in…
Experience
Thermal Mechanical Engineer
Jul 2019 — Present · Bengaluru, IN
Conducted extensive research and development of innovative thermal technologies for notebook cooling, ensuring cutting-edge solutions.Developed and implemented comprehensive validation methodologies to realize new thermal technologies in final products.Performed detailed thermal analysis for notebook system reference designs, validating simulations through thorough and extensive testing.Executed extensive thermal testing with heat pipes and vapor chambers using data loggers and IR cameras to ensure optimal performance and reliability.Conducted fan characterization through wind tunnel testing, providing critical insights for enhancing cooling efficiency.Developed and enforced thermal policies to significantly improve system performance and reliability.Created and optimized fan policies for notebook systems to enhance auditory experience, reducing noise levels while maintaining cooling efficiency.Automated thermal test postprocessing using Python programming to streamline data analysis and improve efficiency.
Skills
- Product Design
- Six Sigma
- Ansys
- R&D
- Ptc Creo
- Pcb Design
- Hypermesh
- Solidworks
- Gd&T
- Nx Unigraphics
- Autocad
- Heat Transfer
- Finite Element Analysis
- Catia
- Engineering
- Geometric Dimensioning & Tolerancing
- Mechanical Engineering
- Unigraphics
- Pro Engineer
- Engineering Management
- Cad
- Project Engineering
- Design for Manufacturing
- Cfd
- Computer-Aided Design (Cad)
- Simulations
- Fmea
- Sheet Metal
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