Arun Gowda
Silicon Carbide Packaging Mission Leader, Principal Engineer at GE Global Research
- Role
- Silicon Carbide Packaging Mission Leader, Principal Engineer at Ge Research
- Location
- Schenectady, NY, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Arun Gowda
Lead a group of engineers and technologists that develops advanced electronics packaging…
Experience
Silicon Carbide Packaging Mission Leader, Principal Engineer
Mar 2016 — Present · Niskayuna, NY, US
Education
Binghamton University
Ph.D., Manufacturing Systems (Electronics Packaging & Manufacturing)
2001 — 2004
RV College Of Engineering
Bachelor of Engineering, Mechanical Engineering
1995 — 1999
Binghamton University
Master of Science, Industrial Engineering
2000 — 2001
Skills
- Triz Practitioner
- Six Sigma
- Electronics
- Power Module Packaging
- Microsystems Integration
- Six Sigma Black Belt
- Design of Experiments
- Electronic Materials
- Electronics Packaging and Manufacturing Processes
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