Arpan Kumar
Electro Mechanical Packaging Design & Analysis Engineer
- Role
- Electro Mechanical Packaging Design & Analysis Engineer at Boeing
- Location
- Bengaluru, KA, IN
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Arpan Kumar
Electromechanical Design Engineer with experience in the design and development of…
Experience
Electro Mechanical Packaging Design & Analysis Engineer
Feb 2024 — Present · Bengaluru, IN
Education
Vellore Institute of Technology
Integrated M.Tech
2017 — 2022
Indo Danish Tool Room
Tool and Die Maker
2012 — 2016
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