Arpan Jadhav

Lead Verification Engineer at Qualcomm

Role
Lead Engineer at Qualcomm
Location
Bengaluru, KA, IN
LinkedIn followers
500 followers

About Arpan Jadhav

ASIC Verification Experience-• SOC level Verification.• Subsystem level Verification. • IP level Verification. • UVM VIP Verification.ASIC Verification Skill-• HDL: Verilog • HVL: System Verilog• Verification Methodologies: Coverage Driven Constraint Random Verification, Assertion Based Verification. • TB Methodology: UVM• EDA Tool: SimVision, DVE tool, Verdi, Questasim, Xilinx ISE Design tool and Riviera Pro. • Domain: ASIC Design Flow, Digital Design methodologies• Other Knowledge: RTL Coding, FSM based design, Simulation, Synthesis, Code and Functional Coverage, Static Timing Analysis, RAL, Perl.• Protocols: AXI, AHB, APB, SPI, Timer based Protocol & SOC Verification

Experience

  1. Lead Engineer

    Qualcomm

    Dec 2023 — Present

Education

  • Rajiv Gandhi Prodyogiki Vishwavidyalaya

    Bachelor's degree, VLSI, Electronics and Communication

    2005 — 2009

  • SIMS Indore

    Master’s Degree, Embedded System and VLSI Design

    2011 — 2013

Skills

  • Static Timing Analysis
  • Digital Electronics
  • Vlsi
  • Register Abstraction Layer(Ral)
  • Fpga
  • Asic
  • Verilog
  • Perl
  • Electronics
  • System Verilog
  • Field-Programmable Gate Arrays (Fpga)
  • Uvm

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Arpan Jadhav — Lead Engineer at Qualcomm in Bengaluru, KA, IN | Unifers