Arpan Jadhav
Lead Verification Engineer at Qualcomm
- Role
- Lead Engineer at Qualcomm
- Location
- Bengaluru, KA, IN
- LinkedIn followers
- 500 followers
About Arpan Jadhav
ASIC Verification Experience-• SOC level Verification.• Subsystem level Verification. • IP level Verification. • UVM VIP Verification.ASIC Verification Skill-• HDL: Verilog • HVL: System Verilog• Verification Methodologies: Coverage Driven Constraint Random Verification, Assertion Based Verification. • TB Methodology: UVM• EDA Tool: SimVision, DVE tool, Verdi, Questasim, Xilinx ISE Design tool and Riviera Pro. • Domain: ASIC Design Flow, Digital Design methodologies• Other Knowledge: RTL Coding, FSM based design, Simulation, Synthesis, Code and Functional Coverage, Static Timing Analysis, RAL, Perl.• Protocols: AXI, AHB, APB, SPI, Timer based Protocol & SOC Verification
Experience
Lead Engineer
Dec 2023 — Present
Education
Rajiv Gandhi Prodyogiki Vishwavidyalaya
Bachelor's degree, VLSI, Electronics and Communication
2005 — 2009
SIMS Indore
Master’s Degree, Embedded System and VLSI Design
2011 — 2013
Skills
- Static Timing Analysis
- Digital Electronics
- Vlsi
- Register Abstraction Layer(Ral)
- Fpga
- Asic
- Verilog
- Perl
- Electronics
- System Verilog
- Field-Programmable Gate Arrays (Fpga)
- Uvm
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