Arman Butt

About Arman Butt

With a steadfast focus on elevating equipment performance, my tenure at Intel as a TD Module & Integration Yield Engineer centers around enhancing module quality, continuous improvement, and driving cost-effective solutions. Our team\'s coordination of resources for preventative maintenance and troubleshooting is pivotal to the company\'s operational excellence.Skills in system testing and problem-solving are the bedrock of our strategy to develop response flow systems for recurring equipment issues. By collaborating with cross-functional teams, we ensure Intel\'s standards for module continuous improvements are consistently exceeded, contributing to the organization\'s sustained success and innovation in a fiercely competitive industry.

Experience

1. Td Module & Integration Yield Engineer

   Intel

   Oct 2015 — Present · Hillsboro, OR, US

   Sustained toolsets with goal of >90% availability ( Chemical Vapor Deposition, UV Thermal processing (cure), and Singular Precursor Activated Radical Chemistry). • Collaborated with various stakeholders such as integration, defect metrology, and parametrics to find root causes of variance and develop solutions to improve process yield. • Utilized statistical tools (e.g, JMP, PCSA) with large datasets for hypothesis testing, analysis and authored white papers to adjust limits and settings for continuous improvement.• Collaborated with manufacturing engineering technicians to resolve complex mechanical issues, applying analytical thinking and innovative solutions to maintain, repair, and prevent equipment failures.• Effectively documented findings and presented results to cross-functional teams through clear written and verbal communication.• Successfully managed multiple projects, ensuring timely completion of deliverables through effective project management skills.• Proficient in quality management systems and standards (e.g, ISO, Six Sigma).• First-point-of-contact for nights/weekends On-Call.Leveraged these skills to contribute to the development of advanced semiconductor technologies, ensuring high yield, quality, and reliability in manufacturing processes. Received 2018 Departmental Award for outstanding contributions to improving Manufacturing (availability for module quarter over quarter to meet Model of Record through sustaining excellence while maintaining Best in Class cost).

Education

• University of Illinois Chicago

  Bachelor of Science (B.S.), Bioengineering

  2008 — 2010

• Loyola Univers

  Bachelor of Science (B.S.), Biophysics

  2005 — 2008

• University of Illinois Chicago

  Doctor of Philosophy (Ph.D.), Bioengineering/Biomedical Engineering

  2010 — 2015

Skills

• Microsoft Word
• Team Leadership
• Energy Dispersive X-Ray Spectroscopy
• Teaching
• Ftir
• Data Analysis
• Ultrasonication
• Team Building
• Customer Service
• Nanotechnology
• Lifesciences
• Fourier Transform Infrared Spectroscopy
• Goniometer
• Sketchup
• Microsoft Office
• Electrochemical Analysis (Potentiostat)
• Originpro 9.0
• Public Speaking
• Research
• Ibm Spss Statistics 21
• X-Ray Diffraction Analysis
• Event Planning
• Biotechnology
• Microsoft Excel
• Powerpoint
• Heat Treatment
• Html
• Metropro® 8.1.5
• Imagej 1.47v
• Biomedical Engineering
• Matlab
• Field Emission Scanning Electron Microscopy
• Xpspeak41
• Ellipsometry
• Atomic Layer and Chemical Vapor Deposition
• Microsoft Powerpoint
• Anodization
• Project Management
• Thermal Annealing