Arkaprabha Sengupta
Principal engineer at Samsung Semiconductor
- Role
- Principal Simulation Engineer at Samsung Semiconductor
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
About Arkaprabha Sengupta
R&D and engineering consulting in the area of chip manufacturing processes. Effective application of computational techniques in modeling of complex engineering processes with a strong background in solid mechanics and finite element analysis.Specialties: Experience in constitutive modeling of materials exhibiting various kinds of non-linear thermomechanical behavior, non-linear finite element analysis, failure analysis, materials testing, multiscale modeling, finite element software development for constitutive modeling of materials.
Experience
Principal Simulation Engineer
Jul 2024 — Present · San Jose, CA, US
Advanced packaging technology R&D
Education
Indian Institute of Technology, Kharagpur
B. Tech., Civil Engineering
1999 — 2003
University of California, Berkeley
M.S., Structural Engineering
2005 — 2006
University of California, Berkeley
PhD, Mechanical Engineering
2006 — 2010
Skills
- Research and Development (R&D)
- R&D
- Fortran
- Perl
- Abaqus
- Finite Element Analysis
- Java
- Simulations
- Matlab
- Programming
- Algorithms
- Semiconductor Packaging
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