Arifur Chowdhury

About Arifur Chowdhury

Staff-level thermal and mechanical engineer leading package and system-level thermal solutions for high-power datacenter AI hardware.At Intel, I lead Integrated Heat Spreader (IHS) assembly architecture and manufacturing readiness for flagship AI accelerators and server platforms, owning critical thermal-mechanical interfaces from package design through NPI qualification and high-volume manufacturing.My scope spans package architecture and process definition, material selection and mechanical reliability, and factory pathfinding, working cross-functionally with silicon design, fabrication, reliability, and global manufacturing teams to deliver scalable, production-ready hardware.My work has been featured in Spectrum and Tom’s Hardware, highlighting breakthrough advances in Intel’s advanced packaging technologies and their role in enabling AI scaling and ultra-large form-factor platforms.Link: Link: hold BS (Summa Cum Laude), MS, and PhD degrees in Mechanical Engineering from the University of Texas at El Paso, with doctoral research in high-pressure thermal-fluid systems, and I completed Harvard Business School’s Business Strategy certification to strengthen my system-level and product-driven impact.I’m driven by technically ambitious, cross-disciplinary challenges and the opportunity to translate complex physics into elegant, manufacturable systems. If you’re working at the intersection of AI hardware, advanced packaging, and thermal-mechanical integration, I’d love to connect.

Experience

1. Staff Engineer

   Intel

   Apr 2022 — Present · Chandler, AZ, US

   Lead package- and system-level thermal architecture and manufacturing readiness for flagship AI accelerators and server platforms, owning critical thermal-mechanical interfaces from package design through NPI qualification and high-volume manufacturing- Own Integrated Heat Spreader (IHS) assembly architecture, defining package stack-ups, TIM1 solutions, adhesives, and assembly flows to ensure thermal performance, mechanical reliability, and yield scalability- Drive end-to-end hardware NPI execution, serving as technical readiness owner from early silicon bring-up through qualification and factory ramp via close coordination with silicon design, fab, materials, reliability, and manufacturing teams- Lead global factory pathfinding and HVM assembly transfer, deploying standardized process monitoring, DOE- and SPC-based controls, and excursion response frameworks to stabilize yield and accelerate ramp- Delivered Intel’s first extra-large mm²) heterogeneous 2.5D PoINT product, resolving challenges in multi-cavity IHS design, warpage control, and socket robustness, resulting in measurable yield improvement.

Education

• The University of Texas at El Paso

  Bachelor of Science (B.S.), Mechanical Engineering

  2010 — 2014

• The University of Texas at El Paso

  Doctor of Philosophy - PhD, Mechanical Engineering

  2015 — 2018

• The University of Texas at El Paso

  Master of Science (M.S.), Mechanical Engineering

  2014 — 2015

• Harvard Business School Online

  Certificate of Specialization in Strategy