Ardalan Nasiri

Senior Electronic Engineer @Qorvo, Inc.

Houston, TX, US
MOBILE NUMBERS
+91 *********19

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WORK HISTORY

Mar 2023 — Present

Senior Electronic Engineer @Qorvo, Inc.

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Greensboro, NC, US

QORVO products are at work connecting, protecting, and powering the planet by bringing core radio frequency (RF) and power technologies and solutions to mobile, infrastructure, IoT, defense/aerospace, and power management markets• RF substrate and packaging design rules, integration, packaging technology development• Working with suppliers to perform design rules and DFM requirements.• Laminate and PCB substrate designs based on customers and Qorvo’s requirements.• Project management techniques, leading technical discussions with suppliers/customers• Working from NPI through HVM phase on mobile, automotive, aerospace & defense.• Design, FMEA, risk assessment, reliability, and test. • Worked closely with cross-functional teams to achieve project goals.

EDUCATION

2014 — 2017

University of Arkansas

MSc, Electrical and Electronics Engineering

2014 — 2020

University of Arkansas

Ph.D., Electrical and Electronics Engineering

N/A

Shiraz University

Bachelor's degree, Engineering Physics/Applied Physics

2009 — 2012

University of Technology

Master's degree, Photonics Engineering

ABOUT ARDALAN NASIRI

As an Electronic Engineer with a PhD degree, I bring over a decade of expertise in the semiconductor and Electronic industries. My career has been dedicated to advancing the field of electronic packaging through innovative design, rigorous validation, and efficient supply chain management.I have a proven track record of developing cutting-edge solutions in microelectronics packaging, silicon interposers, and hardware. My deep understanding of materials science and mechanical engineering principles has enabled me to optimize processes, enhance product reliability, and drive technological advancements.Throughout my career, I have collaborated with cross-functional teams to deliver high-quality products that meet stringent technical requirements. My experience in failure analysis and process optimization has been instrumental in identifying and resolving complex issues and ensuring the success of product development projects.I am passionate about staying at the forefront of industry trends and continuously expanding my knowledge of advanced technologies. My goal is to contribute to the development of innovative electronic packaging solutions that push the boundaries of what is possible.

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