Apoorv Jain
Process Engineering| Advanced Semiconductor Packaging Technology| Wafer Assembly QnR| HVM processing| Semiconductor Process Development and Integration| Semiconductor Physics| Advance Electronic Material Processing
- Role
- Wafer Assembly Technology Development Quality and Reliability Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
About Apoorv Jain
I have embarked on a journey where I learned and grew steadily to strive for excellence…
Experience
Wafer Assembly Technology Development Quality and Reliability Engineer
Jun 2022 — Present · Hillsboro, OR, US
Education
Indian Institute of Technology, Delhi
Bachelor’s Degree, Chemical Engineering
2011 — 2015
University of Florida
Master’s Degree, Chemical Engineering
2015 — 2017
Skills
- Aspen Hysys
- Semiconductors Fabrication
- Characterization
- Squid
- Icpms
- Dls
- Uv/Vis Spectroscopy
- Transmission Electron Microscopy (Tem)
- Semiconductors
- Thin Films
- Mass Transfer
- Igor Pro
- Linux
- Heat Transfer
- Fluid Mechanics
- Public Speaking
- Python
- Dms
- Ftir
- Microsoft Word
- Electronics
- Reaction Engineering
- Xrd
- Pepvd
- Microsoft Office
- Tem
- Powerpoint
- Microsoft Excel
- Matlab
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