Anusha G
Package Design Engineer-Advance Design Technology Solutions
- Role
- Engineering Td Manager at Intel
- Location
- Bengaluru, KA, IN
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Anusha G
14 years of experience in IC packaging, substrate designs and also MEMS…
Experience
Engineering Td Manager
Apr 2022 — Present · IN
Education
Electronics and Instrumentation-UBDT
Bachelor’s Degree
Skills
- Allegro
- Microcontrollers
- Electronics
- Layout Design
- Sigrity Extract Im
- C
- Microsoft Office
- Engineering
- Cadence
- Product Development
- Allegro Package Design
- Autocad
- Ic Packaging
- C++
- Coventorware
- Matlab
- Electrical Engineering
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