Ansuman Mishra
Advanced Silicon Package Design Engineer @ Intel
- Role
- Advanced Silicon Package Design Engineer at Intel
- Location
- Bengaluru, KA, IN
- LinkedIn followers
- 500 followers
About Ansuman Mishra
Dynamic IC Package/PCB Design Engineer with 5 years of comprehensive experience in developingadvanced packaging solutions for state-of-the-art semiconductor products. Demonstrated proficiencyin employing innovative packaging technologies and methodologies to enhance device performance,minimize power consumption, SI/PI detailed analysis and facilitate seamless integration within complex systems. A dedicated team player with a proven track record in cultivating effective partnerships with engineers, technicians, and cross-functional teams, ensuring successful project execution and unparalleled outcomes
Experience
Advanced Silicon Package Design Engineer
Sep 2020 — Present · Bengaluru, IN
Education
Manipal Institute of Technology
Master of Technology - MTech, Microelectronics
2018 — 2020
Siksha 'O' Anusandhan University
Bachelor of Technology (B.Tech.), ELECTRICAL ENGINEEERING
DAV PUBLIC SCHOOL
High School, CBSE
Skills
- Customer Service
- Strategic Planning
- Engineering
- Microsoft Word
- Project Management
- Powerpoint
- Microsoft Excel
- Microsoft Office
- Leadership
- Management
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