Ankush Bansal
Advanced Packaging Integration Engineer at Intel
- Role
- Advanced Ic Packaging Integrator at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Ankush Bansal
Currently working on development of BEOL processes and wafer level packaging…
Experience
Advanced Ic Packaging Integrator
Jan 2024 — Present · Hillsboro, OR, US
Education
Indian Institute of Technology Hyderabad
Bachelor’s Degree, Mechanical Engineering
2011 — 2015
University of Michigan College of Engineering
Doctor of Philosophy (Ph.D.), Manufacturing Engineering
Indian Institute of Technology Hyderabad
Master’s Degree, Integrated Design and Manufacturing
2015 — 2016
Skills
- Powerpoint
- C
- Programming
- Matlab
- English
- Microsoft Word
- Microsoft Office
- Research
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