Aniruddha Kulkarni

Packaging R&D Engineer at Intel Corporation

Role
Packaging R & d Engineer at Intel
Location
Hillsboro, OR, US
LinkedIn followers
500 followers

About Aniruddha Kulkarni

6 years of academic research experience. For my graduate thesis, I am working on…

Experience

  1. Packaging R & d Engineer

    Intel

    Jan 2024 — Present · Hillsboro, OR, US

Education

  • Savitribai Phule Pune University

    Bachelor's Degree, Chemical Engineering

    2011 — 2015

  • University of Florida

    Master’s Degree, Chemical Engineering

    2017

  • University of Florida

    Doctor of Philosophy - PhD, Chemical Engineering

    2023

  • SBOA Public School, Aurangabad

    10th Std

    2005 — 2009

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Aniruddha Kulkarni — Packaging R & d Engineer at Intel in Hillsboro, OR, US | Unifers