Aniket Patil

Role
Staff Engineer, Ic Packaging at 高通
Location
San Diego, CA, US
LinkedIn followers
500 followers

About Aniket Patil

Experienced leader in flagship tier mobile IC Package designs, with over a decade of…

Experience

  1. Staff Engineer, Ic Packaging

    高通

    Nov 2021 — Present

Education

  • Arizona State University

    Master’s Degree, Mechanical Engineering

  • COEP Technological University

    Bachelor of Technology (BTech), Mechanical Engineering

Skills

  • Direct Cad Modeling
  • Asme Y14.5 - 2009
  • Ohsas 18001
  • Pro/Engineer Wildfire 5.0
  • Steam Boilers
  • Vector Canalyzer
  • Design for Manufacturing
  • Geometric Dimensioning & Tolerancing
  • Design Tapeout
  • Lean Manufacturing
  • Autocad
  • Sap
  • Surface Modeling
  • Product Development
  • Fortran
  • Design for Assembly
  • P&Id
  • Autodesk Inventor
  • 3d Printing
  • Abaqus
  • Non-Linear Analysis
  • Gas Turbines
  • C
  • Catia
  • Iso 14001
  • Design Optimization
  • Pfmea
  • Structural Analysis
  • Solidworks
  • Rapid Prototyping
  • Cad
  • Mathematica
  • Nx Unigraphics
  • Plm Tools
  • Six Sigma
  • Tema
  • Hypermesh
  • Dfmea
  • Finite Element Analysis
  • Engineering

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Aniket Patil — Staff Engineer, Ic Packaging at 高通 in San Diego, CA, US | Unifers