Andy Ding
Engineer
- Role
- Hardware Engineer at Microsoft
- Location
- Boise, ID, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
Experience
Hardware Engineer
May 2024 — Present · Boise, ID, US
Enable CXL product in datacenter
Education
City University of Hong Kong
Master of Philosophy (MPhil), Semiconductor Physics and Material
2001 — 2004
Fudan University
Bachelor's degree, Semiconduct Physics
1997 — 2001
Skills
- Debugging
- Sata
- Flash Memory
- C
- C#
- Npi
- Wpf
- Ic
- Ufs
- Design of Experiments
- Manufacturing
- Failure Analysis
- Semiconductor Industry
- Jmp
- Yield
- C++
- Python
- Project Management
- Mixed Signal
- Perl
- Embedded Systems
- Product Engineering
- Engineering Management
- Usb
- Mphy
- Spc
- Semiconductors
- Verilog
- Emmc
- Soc
- Fmea
- Com
- Electronics
- Fpga
- Embedded Software
- Asic
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