Anbarasu Rangasamy
Global Head - R&D Mechatronics Group at Philips Healthcare Innovation Center
- Role
- Global Head - R & d Mechatronics Group, Healthcare Innovation Center at Philips
- Location
- Pune, MH, IN
- LinkedIn followers
- 500 followers
Experience
Global Head - R & d Mechatronics Group, Healthcare Innovation Center
Apr 2013 — Present · Pune, IN
Key Expertise 1) Product Development: Lead and Owner of Design Transfer Improvement (DTI) module at Organization level. Implemented and proven in the medical device development. It comprises of owning Responsibility and Driving for all NPIs- Design For Assembly(DFA), Design For Manufacturability(DFM), Design For Serviceability(DFS) effective implementation- Product validation, Process Validation- Smooth Supplier part purchase agreement Mfg Process Validation- Technology Process Audit in supplier selection- Smoother design transfer to supplier and production- Consistent product quality, minimize iterations and defect rate 2) Product/Component Industrialization: Setting methodical approach and laying steps for industrialization of component/product manufacturing with suppliers; Laying steps for suitable supplier assessment/fitment, manufacturing technology selection, Quality controlling steps at Supplier, Manufacturability assessment sessions for Designers & Suppliers; Assuring program approach and drive for consistent product quality achievement, based on proven experienceDrive effort for - Assessment on design specification- Manufacturability and Mfg Technology assessment- Supplier assessment for a given product- Integrated steps for production- Quality controlling steps/CTQs finalisation Global Head of Mechatronics R&D Group:( April 2013-till now):Lead 45 team members for Design & Development of Healthcare product consists of Engg Managers, Architects, Mechanical, Electrical & Electronics designers Responsible for - Component design concept and Prototype development- Design transfer to Supplier and Production (DFM, DFA, DFS )- Process Validation, Compliance Certification IEC requirements- Field issue resolution- Knowledge Build and Competence development- Design calculations, structural FE simulations (Static/Dynamic)- Packaging design and validation
Education
Indian Institute of Technology, Bombay
M.Tech, Aeronautical Engg
1988 — 1990
Anna University Chennai
B.Tech, Aeronautical Engineering
1982 — 1985
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