Amina M.
SC Packaging Engineer at Texas Instruments
- Role
- Sc Packaging Engineer at Texas Instruments
- Location
- Dallas, TX, US
- LinkedIn followers
- 500 followers
About Amina M.
Semiconductor Packaging Engineer supporting NPI for various flip-chip and wire bond package technologies within the QFN/SOT/Module platform at TI.I love being able to develop solutions that combine technical innovations with strategic thinking in order to maximize our impact.Passionate about outreach and inclusivity for women and minorities pursuing careers in STEM.
Experience
Sc Packaging Engineer
Sep 2020 — Present · Dallas, TX, US
NPDE Platform Development & Technology R&D- Flip-chip QFN & Power Modules | Present- Wire Bond SOT Technologies | 20••••22
Education
University of Houston
Bachelors, Mechanical Engineering
2016 — 2020
The University of Texas at Austin
Executive Masters, Mechanical Engineering
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