Aman Gupta
Advanced IC Packaging R&D Engineer | Intel | Idaho National Laboratory | University of Idaho | NIT
- Role
- Packaging R & d Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Aman Gupta
With a deep-rooted passion for innovation in semiconductor technology, I specialize in…
Experience
Packaging R & d Engineer
Sep 2022 — Present · Hillsboro, OR, US
Education
University of Idaho
Doctor of Philosophy - PhD, Chemical Engineering
2018 — 2022
National Institute of Technology Raipur
Bachelor of Technology (BTech) Honours, Chemical Engineering
2012 — 2016
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