Alperen Ayhan
Sr. Materials Scientist | Yield Development | Failure Analysis | IC Packaging | Process Integration | R&D Engineer
- Role
- Sr Yield Development and Packaging R & d Engineer Wafer Assembly Technology Failure Analysis Lead at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
About Alperen Ayhan
PhD scientist/engineer experienced with high priority R&D projects focused on product and process development delivering groundbreaking change to new technologies and bringing transformational customer value by developing innovative materials solutions to customers biggest challenges in the semiconductor, IC packaging, photovoltaic, and energy storage applications.
Experience
Sr Yield Development and Packaging R & d Engineer Wafer Assembly Technology Failure Analysis Lead
Dec 2024 — Present · Hillsboro, OR, US
Education
Gebze Technical University
Bachelor of Science - BS, Materials Science and Engineering
Penn State University
Master of Science (M.S.), Materials Science and Engineering
2013 — 2014
Penn State University
Doctor of Philosophy (PhD), Chemical Engineering
2015 — 2021
Skills
- Materials Science
- Nanomaterials
- Characterization
- Spectroscopy
- Matlab
- Nanotechnology
- Tga
- Microfabrication
- Afm
- Scanning Electron Microscopy
- Electron Beam Lithography
- Photolithography
- Lithium-Ion Batteries
- Materials
- Nanofabrication
- Physics
- Raman Spectroscopy
- Microsoft Office
- Thin Films
- Powder X-Ray Diffraction
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