Alok Vats
Engineer- R&D at Broadcom Limited
- Role
- Engineer- Fbar R & d Group at Broadcom
- Location
- Fort Collins, CO, US
- LinkedIn followers
- 500 followers
About Alok Vats
Data driven engineering professional with over 10+ years of semiconductor industry experience. Over 5 years experience as R&D packaging engineer, HDI substrate build up process, Module owner of electrodeless Cu, Elytic Cu plating and DESMEAR process. Qualification of low loss buildup films for scaling down FLS. Over 8 Year experience in RF MEMS production fab, supporting SMT AU and Cu bumping process, leading process development and integration for RF MEMS devices, Resolving line yield issue using model based problem solving methodology.
Experience
Engineer- Fbar R & d Group
Nov 2017 — Present · Fort Collins, CO, US
As a process development R&D engineer, I am responsible to drive process characterization of various process modules in RF-MEMS process flow. Driving root cause analysis for device failures due to defectivity at various process modules.Over last 5 years, my primary focus has been to meet, 1) die size reduction and module shrink targets to meet technology roadmap, 2) Delivering on next generation RF-MEMS device with improved linear & non-linear performance to meet customer RF front-end design envelops.Working with FAB process development, Design, Quality & Reliability. NPI and Assembly and Packaging teams to see new technology parts ramp successfully and meet time to market schedules.
Education
South Dakota Mines
SM/PhD, Materials Science & Engineering, Nanoscience and Nanoengineering Program
2003 — 2011
Gulbarga University
B.E, Ceramic Engineering
1995 — 1999
Skills
- Physics
- Semiconductors
- R
- Engineering
- Spc
- Engineering Management
- Powder X-Ray Diffraction
- Device Characterization
- R&D
- Silicon
- Solar Cells
- Continuous Improvement
- Chemistry
- Characterization
- Spectroscopy
- Design of Experiments
- Manufacturing
- Materials Science
- Failure Analysis
- Semiconductor Industry
- Photovoltaics
- Process Engineering
- Tem
- Afm
- Research and Development (R&D)
- Predictive Modeling
- 2.5d & 3d Packaging
- Thin Films
- Process Simulation
- Statistical Process Control (Spc)
- Hdi Substrates
- Simulations
- Electroplating
- Labview
- Optical Microscopy
- Scanning Electron Microscopy
- Edx
- Jmp
- Nanoparticles
- Nanotechnology
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