Alexandre V.

Leader Packaging Technology @Valeo

Paris, FR
MOBILE NUMBERS
+91 *********19

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WORK HISTORY

Mar 2018 — Present

Leader Packaging Technology @Valeo

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Bobigny, FR

EDUCATION

1987 — 1989

Ecole préparatoire Saint Louis (Paris V)

Post Bac S, Mathematics, Physics, Chemistry

1989 — 1992

Ecole Nationale Supérieure de Chimie à Clermont Ferrand (ENSCCF)

Engineer (Bac+5), Chemistry & Material Sciences

1993 — 1996

Université Paul Sabatier Toulouse III

Ph-D, Microsystems packaging

ABOUT ALEXANDRE V.

I received the diploma of engineer in Chemistry in 1992. I completed his PhD (LAAS-CNRS) in 3D Microsystems packaging at the university of Toulouse at the end of 1996; My PhD thesis deals with the design, the finite element modelisation (Ansys), and the feasibility of a 3D-microsystem including micro-pump, sensors, ASICs; I was involved in Barmint (Basic Research for Microsystem Integration) European project.From 1996 to I joined ASTRIUM (formerly Matra Marconi Space) and worked in the field of aeronautic, defense and space. The mains activities were many microelectronic technologies and packaging areas, including HTCC package, conformal coating, and interconnections.From August to January 2008, I joined SOLECTRON as Advanced Technology Engineer in the Design & Technology Centre department. I was involved with many assembly technologies. And I supported the project managers to the technical management and development of new products. I was in charge of the technical management for the european project VIGOR, PIDEA project ORBITA, and LIFE project AMELIE on RoHS reliability. From February 2008 to June 2012, I have joined 3D PLUS company as business unit manager for 3D packaging development based on bus metal for vertical interconnection. I performed the technology towards Taiwanese company. I defined & designed a product catalogue based on stacked technology and manage the supply chain. Since July 2012, I moved to program manager with ADELES program; internal developments to improve reliability, performances and customer satisfactions.From June 2016, He joined ASE Europe as Application Engineering manager. This position is related to the ASE technology promotion and the engineering interface between ASE factories and European customers.Specialties: Packaging 2D upto 3D, Interconnections, Thermal management, SMD, PTH, COB/COF, HybridDesign of Experiment, ReliabilityProject Management

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Alexandre V. — Leader Packaging Technology at Valeo in Paris, FR | Unifers