Akshaya Kulkarni
- Role
- Packaging R & d Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
EngineeringView LinkedIn profile
About Akshaya Kulkarni
As a Far Back End Integration Engineer, I support Intel’s key upcoming technologies such…
Experience
Packaging R & d Engineer
Mar 2022 — Present
Education
Shubham Raje Junior College
HSC with Computer Science as Vocational subject
2012 — 2014
Texas A&M University
Master of Engineering - MEng, Chemical Engineering
2018 — 2020
Institute Of Chemical Technology
Bachelor of Engineering (B.E.), Chemical Engineering
2014 — 2018
Skills
- Public Speaking
- Microsoft Word
- Microsoft Excel
- Microsoft Office
- Matlab
- Windows
- Public Relations
- Chemical Engineering
- Creative Writing
- Teamwork
- Aspen Plus
- Management
- C++
- Event Planning
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