Akshatha M

PCB and IC package engineer | Silicon Package Design Engineer @ Intel Corporation | BE in Electronics Engineering

Role
Silicon Package Design Engineer at Intel
Location
Mysuru, IN
LinkedIn followers
500 followers

About Akshatha M

As a Silicon Package Design Engineer I strive to deliver comprehensive IC package…

Experience

  1. Silicon Package Design Engineer

    Intel

    Jul 2022 — Present · Bengaluru, IN

    Led end-to-end package design for high-performance digital and mixed-signal ICs used in computing and communication products. Experience in substrate layout of flip chip packagesDelivered 14+ package design tape-outs with complete ownership from concept to manufacturing handoff.Delivered the design from scratch to the Tape-Out, including Ballmap planning, SI/PI Review, Constraint setup, Gerber Review, and Vendor Collateral review. Worked on package design including feasibility studies, substrate design/routing, package stack up.Delivered DDR & PCIe substrate designs ensuring compliance with SI/PI metrics and enabling successful tape-out.Collaborated with cross-functional stakeholders to define package specifications and performance targets.Conducted comprehensive thermal, mechanical, and electrical simulations to optimize package performance and reliability.Trained peers on loopback design concepts and enhanced review methods to strengthen power integrity checks.

Education

  • Sadvidya pre-university college

    Pre-University, Electronics

    2016 — 2018

  • Vidyavardhaka College of Engineering

    Bachelor of Engineering - BE, Electrical, Electronics and Communications Engineering

    2018 — 2022

  • Birla Institute of Technology and Science, Pilani

    Master of Technology - MTech, VLSI design and Microelectronics

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Akshatha M — Silicon Package Design Engineer at Intel in Mysuru, IN | Unifers