Akshaj Singhal
Graduate Research Assistant @U.S. Nsf Internet Of Things For Precision Agriculture Iot4ag
Signup · Get unlimited contacts
WORK HISTORY
Graduate Research Assistant @U.S. Nsf Internet Of Things For Precision Agriculture Iot4ag
Philadelphia, PA, US
I developed and optimized the Flip-Chip interconnect process for the fabrication of flexible microelectronics sensors. I also designed electrical-mechanical test systems integrating UTM instrumentation and SMU based data acquisition to test reliability under high cycle bending. Submitted a paper to sensors letters titled \"Manufacturing Printed Hybrid Sensors on Nanocellulose-Coated Paper\".
EDUCATION
Indian Institute of Technology, Kanpur
Bachelor of Technology - BTech, Materials Science and Engineering
University of Pennsylvania
Master of Science - MS, Materials Science and Engineering
ABOUT AKSHAJ SINGHAL
I\'m a Materials Science and Engineering grad student at University of Pennsylvania. I work on Microelectronic devices - fabrication, packaging, and electrical-mechanical testing. I love everything nanotech and nanofab.I\'m looking for full-time positions as a Process Engineer / Packaging Engineer anywhere that develops microelectronic devices / semiconductor chips, starting May 2026.
This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.