Ajay Pillai

Packaging R&D engineer

Role
Packaging R & d Engineer at Intel
Location
Hillsboro, OR, US
LinkedIn followers
500 followers

About Ajay Pillai

As a mechanical engineer, I make it happen CONCEPT -> REALITY

Experience

  1. Packaging R & d Engineer

    Intel

    Apr 2024 — Present · Hillsboro, OR, US

Education

  • Vellore Institute of Technology

    Bachelor's degree, Mechanical Engineering

  • Cornell University

    Master's degree, Mechanical Engineering

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Ajay Pillai — Packaging R & d Engineer at Intel in Hillsboro, OR, US | Unifers