Ahmed Yousaf
Semiconductor Professional | 2.5D/3D Packaging Technology
- Role
- Senior Staff Engineer Packaging Technologist at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
About Ahmed Yousaf
Packaging Technologist at Intel skilled in process integration, wafer level assembly, TSV, die prep, and stakeholder management.
Experience
Senior Staff Engineer Packaging Technologist
Feb 2026 — Present
Education
Lahore University of Management Sciences
BS, Chemistry
2010 — 2014
Arizona State University
Doctor of Philosophy - PhD, Materials Chemistry
2014 — 2018
Skills
- Research
- Colloid
- Materials Science
- Stereolithography
- Fourier Transform Infrared Spectroscopy
- Scanning Electron Microscopy
- Microsoft Office
- Transmission Electron Microscopy (Tem)
- Chemical Vapor Deposition (Cvd)
- Teamwork
- Photolithography
- Matlab
- Nanomaterials
- Thermogravimetric Analysis (Tga)
- Uv/Vis Spectroscopy
- Thin Films
- Titan (Aberration Corrected Transmission Electron Microscopy)
Find verified contacts for anyone on LinkedIn
Unifers gives sales teams verified emails and direct dials, enriched profiles, and outreach that lands in the inbox.
Free plan included · No credit card required
This profile is compiled from publicly available professional sources. Unifers is not affiliated with or endorsed by LinkedIn. Request removal of this profile.