Adarsh Bakkireddy
Module Development Engineer at Intel Corporation
- Role
- Module Development Engineer at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
About Adarsh Bakkireddy
A Dynamic and highly motivated graduate student with an MS degree in Chemical Engineering…
Experience
Module Development Engineer
Dec 2023 — Present · Hillsboro, OR, US
Applies scientific and engineering principles to design, develop, and qualify packaging solutions and materials used to hold, display, dispense, and safely transport all types of products. Manages the packaging development process including packaging artwork development, concepts, prototypes, qualification testing, specification documentation, coordination with manufacturing, regulatory, logistics, and supply chain partners, vendor selection and qualification, manufacturing start-up, and benchmarking. Identifies and implements processes to drive efficiency, cost, manufacturability, waste reduction, sustainability, logistics, and/or packaging supply chain improvement opportunities. Consultants to cross-organizational partners on product launch, branding and marketing, SKU, barcodes and labeling, scaling, packaging supply chain, logistics, regulatory and compliance, and bills of material requirements for shipments into Intel’s product distribution channel.
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