Bernie Adams
Advanced Semiconductor Packaging
- Role
- Sr Director at Spil
- Location
- San Diego, CA, US
- LinkedIn followers
- 500 followers
About Bernie Adams
Global Semiconductor Executive An innovative leader and superior revenue generator, I offer a unique mix of engineering, sales, strategic marketing, finance, contract negotiations, and product development skills. I have crafted/executed winning global strategies to drive YOY sales and profits for major high tech manufacturers as well as smaller firms in multiple B2B and B2C channels. My key skills include:* Advanced Packaging: Fan Out, WLCSP, TSV, Au bumping. 5nm through 180nm devices.* Fine Tuning Supply Chain, Operations, Engineering, Manufacturing, and QA for Global Customers* Building superior Sales, Marketing and Support Teams* Positioning firms for mergers and acquisitions.divested two successfully, purchased one.* Securing New customer relationships to drive explosive revenue growth* Expert in Factory Automation and Control Systems* Management training at Rockwell Automation and General Motors JV, Flip ChipSpecialties: Global Growth & Brand Strategies / Product Development / Channel Sales / Alliances / P&L / ROI / C-Level Relationships / Distribution Networks / Turnarounds / Risk / Engineering/ Financial & Cost Controls / Negotiations/Operations
Experience
Sr Director
Sep 2024 — Present · San Diego County, CA, US
Technical Program Management, Advanced Packaging.
Education
Purdue University
BS, Electrical Engineering
1978 — 1982
University of Pittsburgh Joseph M. Katz Graduate School of Business
EMBA, International Finance
1993 — 1994
Skills
- Forecasting
- B2b
- Selling
- Negotiation
- Sales
- Business Development
- Product Management
- Project Management
- Supply Chain
- Budgets
- Sales Process
- Iso Certifications
- Manufacture
- Semiconductors
- Leadership
- Product Development
- Sales Operations
- Account Management
- Cross-Functional Team Leadership
- Engineering
- Marketing Strategy
- Manufacturing
- Strategy
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