Ange Christian Iradukunda
Semiconductor Packaging Engineer
- Role
- Semiconductor Packaging Engineer at Texas Instruments
- Location
- Dallas, TX, US
- LinkedIn followers
- 500 followers
About Ange Christian Iradukunda
Mechanical Engineering Ph.D. graduate with a solid track record in the development and validation of novel cooling solutions, design optimization of electronic packages for thermomechanical reliability, and characterization of novel specialized materials for improving cooling/packaging. This background has helped me gain valuable skills and experience in the areas of:• Heat transfer and thermal design optimization • Structural/thermal FEA & CFD modeling• Prototyping and electronics assembly processes • Design of experiments for cooling solution/package performance validation and for material characterization • Programming and software skills including for CAD, experimental instrument control, data acquisition, data analysis and reliability statistics • Project management, cross-disciplinary collaboration, written and verbal communication as well as self-direction with an ability to take on complex problems, define a direction, and create solutions.
Experience
Semiconductor Packaging Engineer
Apr 2023 — Present · Dallas, TX, US
Education
University of Arkansas
Bachelor’s Degree, Mechanical Engineering
University of Arkansas
Doctor of Philosophy - PhD, Mechanical Engineering
University of Arkansas
Master's degree, Mechanical Engineering
2018 — 2020
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