Abdul Talukdar
Product Integration and Yield Engineering Manager
- Role
- Product Integration and Yield Engineering Manager at Intel
- Location
- Hillsboro, OR, US
- LinkedIn followers
- 500 followers
About Abdul Talukdar
10+ years in Intel (semiconductor processing and packaging) as Integration and Yield…
Experience
Product Integration and Yield Engineering Manager
Feb 2024 — Present · Hillsboro, OR, US
Leading and managing cross-functional teams to successfully deliver Intel advanced packaging technology for multitude of Intel Foundry products. • Establish process readiness, technology roadmap, and develop manufacturability of Intel’s latest assembly technologies (2.5D/3D, Hybrid, COWOs, Chip to Wafer etc).• Structure organization, budget planning and define scope for latest packaging technologies to effective allocation of Intel Foundry resources.• Collaboration with Foundry customer and OSAT to deliver technology readiness on advanced packaging circuit for high volume manufacturing.• 3DIC test methodology development (ATE), electrical test content design and optical screening (metrology) development for reliable and quality technology development.• Leading quality and reliability improvement projects in advanced packaging by managing numerous teams across continents.
Education
Bangladesh University of Engineering and Technology
BSc
2003 — 2007
King Abdullah University of Science and Technology(KAUST)
MSc
2009 — 2011
University of South Carolina-Columbia
Doctor of Philosophy (Ph.D.)
2011 — 2014
Skills
- Pspice
- Mems
- Experimentation
- Design of Experiments
- Originlab
- Optical Microscopy
- Characterization
- Spectroscopy
- Sensors
- Bosch
- Scanning Electron Microscopy
- Device Characterization
- Optical Characterization
- Rapid Thermal Processing
- Semiconductors
- Semiconductor Device
- C-V Measurement Using Lcr Meter
- Wire Bonding
- Lock in Amplifier
- Agilent Ads
- Atomic Force Microscopy (Afm)
- Atomic Layer Deposition
- Cvd
- Surface Acoustic Wave
- Nanotechnology
- I-V
- Microfabrication
- Labview
- Quantum Cascade Laser (Qcl)
- Electron Beam Evaporation
- Inductively Coupled Plasma
- Drie
- Pecvd
- Nems
- C-V
- Reactive Ion Etching
- Top and Back Side Alignment
- Photo Acoustic Spectroscopy
- Afm
- Photolithography
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